Application of Ultrasonic Power in Forming Sn58Bi/Cu Solder Joints with Trace Si3N4 Nanowire Doping
Article in Journal of Materials Engineering and Performance (May 2024)
The most recent citing publications are shown below. View all 9 publications that cite this research output on Dimensions.
Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study
Article in Surface and Coatings Technology (May 2024)
Impacts of temperature gradient on microstructure and properties of Cu/Sn58Bi-0.6B4C NPs/Cu joints fabricated by vacuum thermal compression bonding
Article in Materials Today Communications (March 2024)