Evaluation of flip-chip bonding electrical connectivity for ultra-large array infrared detector.
Article in Optics Express (March 2024)
The most recent citing publications are shown below. View all 9 publications that cite this research output on Dimensions.
A 3 Degrees-of-Freedom Electrothermal Micro-Positioner for Optical Chip-to-Chip Alignment
Article in Journal of Microelectromechanical Systems (March 2024)
On-chip hybrid integration of swept frequency distributed-feedback laser with silicon photonic circuits using photonic wire bonding.
Article in Optics Express (January 2024)