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Mendeley readers
| Chapter title |
Embedded Passives
|
|---|---|
| Chapter number | 14 |
| Book title |
Materials for Advanced Packaging
|
| Published by |
Springer, Boston, MA, January 2009
|
| DOI | 10.1007/978-0-387-78219-5_14 |
| Book ISBNs |
978-0-387-78218-8, 978-0-387-78219-5
|
| Authors |
Dok Won Lee, Liangliang Li, Shan X. Wang, Jiongxin Lu, C. P. Wong, Swapan K. Bhattacharya, John Papapolymerou, Lee, Dok Won, Li, Liangliang, Wang, Shan X., Lu, Jiongxin, Wong, C. P., Bhattacharya, Swapan K., Papapolymerou, John |
Mendeley readers
The data shown below were compiled from readership statistics for 4 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 4 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 1 | 25% |
| Professor > Associate Professor | 1 | 25% |
| Researcher | 1 | 25% |
| Student > Master | 1 | 25% |
| Readers by discipline | Count | As % |
|---|---|---|
| Materials Science | 4 | 100% |