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Chapter title |
MEMS Packaging and Thermal Issues in Reliability
|
---|---|
Chapter number | 37 |
Book title |
Springer Handbook of Nanotechnology
|
Published in |
ADS, January 2004
|
DOI | 10.1007/3-540-29838-x_37 |
Book ISBNs |
978-3-54-001218-4, 978-3-54-029838-0
|
Authors |
Yu-Ting Cheng Prof., Liwei Lin Prof., Yu-Ting Cheng, Liwei Lin |
Editors |
Bharat Bhushan Prof. |