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Failure Analysis of Integrated Circuits

Overview of attention for book
Attention for Chapter 3: Package Analysis: SAM and X-ray
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4 Mendeley
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Chapter title
Package Analysis: SAM and X-ray
Chapter number 3
Book title
Failure Analysis of Integrated Circuits
Published by
Springer, Boston, MA, January 1999
DOI 10.1007/978-1-4615-4919-2_3
Book ISBNs
978-1-4613-7231-8, 978-1-4615-4919-2
Authors

Thomas M. Moore, Cheryl D. Hartfield, Moore, Thomas M., Hartfield, Cheryl D.

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 4 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 4 100%

Demographic breakdown

Readers by professional status Count As %
Student > Bachelor 2 50%
Student > Ph. D. Student 1 25%
Student > Doctoral Student 1 25%
Readers by discipline Count As %
Engineering 3 75%
Physics and Astronomy 1 25%