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Chapter title |
Damage Analysis of Semiconductor Chip during Wire Bonding Process
|
---|---|
Chapter number | 101 |
Book title |
Computational Mechanics ’95
|
Published by |
Springer, Berlin, Heidelberg, January 1995
|
DOI | 10.1007/978-3-642-79654-8_101 |
Book ISBNs |
978-3-64-279656-2, 978-3-64-279654-8
|
Authors |
Toru Ikeda, Noriyuki Miyazaki, Kiyoteru Kudo, Tsuyoshi Munakata |