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Power Electronic Packaging

Overview of attention for book
Attention for Chapter 6: Thermal Management, Design, and Cooling for Power Electronics
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Citations

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7 Mendeley
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Chapter title
Thermal Management, Design, and Cooling for Power Electronics
Chapter number 6
Book title
Power Electronic Packaging
Published by
Springer, New York, NY, January 2012
DOI 10.1007/978-1-4614-1053-9_6
Book ISBNs
978-1-4614-1052-2, 978-1-4614-1053-9
Authors

Yong Liu, Liu, Yong

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 7 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 7 100%

Demographic breakdown

Readers by professional status Count As %
Student > Master 3 43%
Student > Doctoral Student 1 14%
Professor > Associate Professor 1 14%
Unknown 2 29%
Readers by discipline Count As %
Engineering 5 71%
Unknown 2 29%