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Mendeley readers
Title |
Wafer-Level Chip-Scale Packaging
|
---|---|
Published by |
Springer New York, September 2014
|
DOI | 10.1007/978-1-4939-1556-9 |
ISBNs |
978-1-4939-1555-2, 978-1-4939-1556-9
|
Authors |
Qu, Shichun, Liu, Yong |
Mendeley readers
The data shown below were compiled from readership statistics for 21 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 21 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 8 | 38% |
Researcher | 5 | 24% |
Student > Master | 2 | 10% |
Lecturer > Senior Lecturer | 1 | 5% |
Professor > Associate Professor | 1 | 5% |
Other | 0 | 0% |
Unknown | 4 | 19% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 11 | 52% |
Materials Science | 3 | 14% |
Chemical Engineering | 1 | 5% |
Physics and Astronomy | 1 | 5% |
Unknown | 5 | 24% |