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RF and Microwave Microelectronics Packaging

Overview of attention for book
Attention for Chapter 12: Technology Research on AlN 3D MCM
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Chapter title
Technology Research on AlN 3D MCM
Chapter number 12
Book title
RF and Microwave Microelectronics Packaging
Published by
Springer, Boston, MA, January 2010
DOI 10.1007/978-1-4419-0984-8_12
Book ISBNs
978-1-4419-0983-1, 978-1-4419-0984-8
Authors

Zhang Hao, Cui Song, Liu Junyong, Hao, Zhang, Song, Cui, Junyong, Liu