A pattern reconfigurable microstrip patch ESPAR designed for a hybrid beam-forming testbed
Conference proceeding (March 2023)
The most recent citing publications are shown below. View all 59 publications that cite this research output on Dimensions.
Conference proceeding (March 2023)
Article in IEEE Transactions on Circuits & Systems II Express Briefs (March 2023)
Article in IEEE Transactions on Wireless Communications (December 2022)