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| Chapter title |
Multi-chip Modules and Multi-chip Packaging
|
|---|---|
| Chapter number | 7 |
| Book title |
Systems-Level Packaging for Millimeter-Wave Transceivers
|
| Published by |
Springer, Cham, January 2019
|
| DOI | 10.1007/978-3-030-14690-0_7 |
| Book ISBNs |
978-3-03-014689-4, 978-3-03-014690-0
|
| Authors |
Mladen Božanić, Saurabh Sinha |