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Chapter title |
Forming and Packing Process of High Density Mental Micro-channel Heat Sink
|
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Chapter number | 56 |
Book title |
Proceedings of the Seventh Asia International Symposium on Mechatronics
|
Published by |
Springer, Singapore, August 2019
|
DOI | 10.1007/978-981-32-9441-7_56 |
Book ISBNs |
978-9-81-329440-0, 978-9-81-329441-7
|
Authors |
Hui Lv, Wen Zhao, Lv, Hui, Zhao, Wen |