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Chapter title |
Simulation Study on Thermal-Mechanical Coupling of Antenna Array BGA Package
|
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Chapter number | 4 |
Book title |
Proceedings of the Seventh Asia International Symposium on Mechatronics
|
Published by |
Springer, Singapore, January 2020
|
DOI | 10.1007/978-981-32-9437-0_4 |
Book ISBNs |
978-9-81-329436-3, 978-9-81-329437-0
|
Authors |
Liangchen Tan, Wenqiu Tang, Tan, Liangchen, Tang, Wenqiu |