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Chapter title |
Diffusion Bonding of AgC–Cu Bi-layered Electrical Contacts
|
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Chapter number | 189 |
Book title |
TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings
|
Published by |
Springer, Cham, January 2020
|
DOI | 10.1007/978-3-030-36296-6_189 |
Book ISBNs |
978-3-03-036295-9, 978-3-03-036296-6
|
Authors |
Daudi R. Waryoba, Linsea Paradis, Waryoba, Daudi R., Paradis, Linsea |