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How Transistor Area Shrank by 1 Million Fold

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Cover of 'How Transistor Area Shrank by 1 Million Fold'

Table of Contents

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    Book Overview
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    Chapter 1 Integrated Circuit Revolutions
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    Chapter 2 Overview of Integrated Circuit Manufacturing
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    Chapter 3 Semiconductors, Diodes, Transistors, and Inverters
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    Chapter 4 Engineering MOS Transistors for High Speed and Low Power
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    Chapter 5 Parasitic MOS and Bipolar Transistors in CMOS ICs
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    Chapter 6 CMOS Inverter Manufacturing Flow: Part 1 Wafer Start Through Transistors
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    Chapter 7 CMOS Inverter Manufacturing Flow: Part 2 Transistors Through Single-Level Metal
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    Chapter 8 CMOS Inverter Manufacturing Flow: Part 3 Additional Levels of Metal Through PO
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    Chapter 9 The Incredible Shrinking IC: Part 1 Enabling Technologies
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    Chapter 10 The Incredible Shrinking IC: Part 2 FEOL Isolation Scaling and Transistor Scaling
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    Chapter 11 The Incredible Shrinking IC: Part 3 BEOL Aluminum Alloy Single and Multilevel Metal
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    Chapter 12 The Incredible Shrinking IC: Part 4 BEOL Low-K Intermetal Dielectrics and Multilevel Copper Metallization
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    Chapter 13 Anecdotes
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    Chapter 14 Wrap Up and What Is Next?
Attention for Chapter 2: Overview of Integrated Circuit Manufacturing
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Chapter title
Overview of Integrated Circuit Manufacturing
Chapter number 2
Book title
How Transistor Area Shrank by 1 Million Fold
Published by
Springer, Cham, January 2020
DOI 10.1007/978-3-030-40021-7_2
Book ISBNs
978-3-03-040020-0, 978-3-03-040021-7
Authors

Howard Tigelaar, Tigelaar, Howard

View on publisher site

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