Platinum Interconnections for Harsh Environment Applications Using Atmospheric Pressure Sputtering
Article in Transactions of The Japan Institute of Electronics Packaging (December 2023)
The most recent citing publications are shown below. View all 6 publications that cite this research output on Dimensions.
Article in Transactions of The Japan Institute of Electronics Packaging (December 2023)
Article in Frontiers in Chemistry (November 2021)
Article in Frontiers in Chemistry (November 2021)