Effect of heat treatment processes on the Cu-electrodeposited through glass vias (TGV) plate
Article in Journal of Alloys and Compounds (August 2024)
The most recent citing publications are shown below. View all 39 publications that cite this research output on Dimensions.
Article in Journal of Alloys and Compounds (August 2024)
Article in ACS Applied Engineering Materials (February 2024)
Article in Journal of The Japan Institute of Electronics Packaging (November 2023)