Large-Scale 3D Chips: Challenges and Solutions for Design Automation, Testing, and Trustworthy Integration

Overview of attention for article published in IPSJ Transactions on System and LSI Design Methodology, January 2017

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In the top 25% of all research outputs scored by Altmetric
Good Attention Score compared to outputs of the same age (76th percentile)

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Modified direct bond interconnect for FPAs

Grant US-11670616-B2

United States of America

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