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Mendeley readers
Chapter title |
Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
|
---|---|
Chapter number | 16 |
Book title |
Lead-Free Electronic Solders
|
Published by |
Springer, Boston, MA, January 2006
|
DOI | 10.1007/978-0-387-48433-4_16 |
Book ISBNs |
978-0-387-48431-0, 978-0-387-48433-4
|
Authors |
Seung-Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu, Huang-Lin Chao, Paul S. Ho, Min Ding, Peng Su, Trent Uehling, Lakshmi N. Ramanathan |
Mendeley readers
The data shown below were compiled from readership statistics for 12 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 12 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 4 | 33% |
Researcher | 2 | 17% |
Student > Bachelor | 1 | 8% |
Student > Master | 1 | 8% |
Student > Doctoral Student | 1 | 8% |
Other | 0 | 0% |
Unknown | 3 | 25% |
Readers by discipline | Count | As % |
---|---|---|
Materials Science | 4 | 33% |
Chemistry | 3 | 25% |
Engineering | 2 | 17% |
Biochemistry, Genetics and Molecular Biology | 1 | 8% |
Unknown | 2 | 17% |