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Lead-Free Electronic Solders

Overview of attention for book
Cover of 'Lead-Free Electronic Solders'

Table of Contents

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    Book Overview
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    Chapter 1 Thermodynamics and phase diagrams of lead-free solder materials
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    Chapter 2 Phase diagrams of Pb-free solders and their related materials systems
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    Chapter 3 The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints
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    Chapter 4 Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications
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    Chapter 5 Rare-earth additions to lead-free electronic solders
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    Chapter 6 Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders
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    Chapter 7 Sn-Zn low temperature solder
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    Chapter 8 Composite lead-free electronic solders
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    Chapter 9 Processing and material issues related to lead-free soldering
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    Chapter 10 Interfacial reaction issues for lead-free electronic solders
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    Chapter 11 Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys
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    Chapter 12 Deformation behavior of tin and some tin alloys
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    Chapter 13 Mechanical fatigue of Sn-rich Pb-free solder alloys
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    Chapter 14 Life expectancies of Pb-free SAC solder interconnects in electronic hardware
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    Chapter 15 Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments
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    Chapter 16 Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages
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    Chapter 17 Electromigration issues in lead-free solder joints
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    Chapter 18 Stress analysis of spontaneous Sn whisker growth
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    Chapter 19 Sn-whiskers: truths and myths
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    Chapter 20 Tin pest issues in lead-free electronic solders
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    Chapter 21 Issues related to the implementation of Pb-free electronic solders in consumer electronics
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    Chapter 22 Impact of the ROHS directive on high-performance electronic systems
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    Chapter 23 Impact of the ROHS Directive on high-performance electronic systems
Attention for Chapter 9: Processing and material issues related to lead-free soldering
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Citations

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6 Mendeley
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Chapter title
Processing and material issues related to lead-free soldering
Chapter number 9
Book title
Lead-Free Electronic Solders
Published by
Springer, Boston, MA, January 2006
DOI 10.1007/978-0-387-48433-4_9
Book ISBNs
978-0-387-48431-0, 978-0-387-48433-4
Authors

Laura J. Turbini

View on publisher site
Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 6 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 6 100%

Demographic breakdown

Readers by professional status Count As %
Professor > Associate Professor 2 33%
Researcher 2 33%
Student > Ph. D. Student 1 17%
Student > Master 1 17%
Readers by discipline Count As %
Materials Science 2 33%
Engineering 2 33%
Chemistry 1 17%
Unknown 1 17%

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