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Mendeley readers
Chapter title |
Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging
|
---|---|
Chapter number | 8 |
Book title |
Nano-Bio- Electronic, Photonic and MEMS Packaging
|
Published by |
Springer, Boston, MA, January 2010
|
DOI | 10.1007/978-1-4419-0040-1_8 |
Book ISBNs |
978-1-4419-0039-5, 978-1-4419-0040-1
|
Authors |
Hongjin Jiang, Kyoung-sik (Jack) Moon, C.P. Wong, Jiang, Hongjin, (Jack) Moon, Kyoung-sik, Wong, C.P. |
Mendeley readers
The data shown below were compiled from readership statistics for 2 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 2 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Researcher | 1 | 50% |
Unknown | 1 | 50% |
Readers by discipline | Count | As % |
---|---|---|
Medicine and Dentistry | 1 | 50% |
Unknown | 1 | 50% |