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Nano-Bio- Electronic, Photonic and MEMS Packaging

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Cover of 'Nano-Bio- Electronic, Photonic and MEMS Packaging'

Table of Contents

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    Book Overview
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    Chapter 1 Nanomaterials for Microelectronic and Bio-packaging
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    Chapter 2 Nano-conductive Adhesives for Nano-electronics Interconnection
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    Chapter 3 Biomimetic Lotus Effect Surfaces for Nanopackaging
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    Chapter 4 Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials
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    Chapter 5 Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications
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    Chapter 6 1D Nanowire Electrode Materials for Power Sources of Microelectronics
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    Chapter 7 Mechanical Energy Harvesting Using Wurtzite Nanowires
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    Chapter 8 Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging
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    Chapter 9 Introduction to Nanoparticle-Based Integrated Passives
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    Chapter 10 Thermally Conductive Nanocomposites
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    Chapter 11 Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension
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    Chapter 12 On-Chip Thermal Management and Hot-Spot Remediation
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    Chapter 13 Some Aspects of Microchannel Heat Transfer
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    Chapter 14 Nanoprobes for Live-Cell Gene Detection
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    Chapter 15 Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips
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    Chapter 16 Packaging of Biomolecular and Chemical Microsensors
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    Chapter 17 Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging
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    Chapter 18 Molecular Dynamics Applications in Packaging
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    Chapter 19 Nanoscale Deformation and Strain Analysis by AFM/DIC Technique
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    Chapter 20 Nano-Scale and Atomistic-Scale Modeling of Advanced Materials
Attention for Chapter 20: Nano-Scale and Atomistic-Scale Modeling of Advanced Materials
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Citations

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Chapter title
Nano-Scale and Atomistic-Scale Modeling of Advanced Materials
Chapter number 20
Book title
Nano-Bio- Electronic, Photonic and MEMS Packaging
Published by
Springer, Boston, MA, January 2010
DOI 10.1007/978-1-4419-0040-1_20
Book ISBNs
978-1-4419-0039-5, 978-1-4419-0040-1
Authors

Ruo Li Dai, Wei-Hsin Liao, Chun-Te Lin, Kuo-Ning Chiang, Shi-Wei Ricky Lee, Dai, Ruo Li, Liao, Wei-Hsin, Lin, Chun-Te, Chiang, Kuo-Ning, Lee, Shi-Wei Ricky

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 1 100%

Demographic breakdown

Readers by professional status Count As %
Professor 1 100%
Readers by discipline Count As %
Unknown 1 100%