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Three Dimensional System Integration

Overview of attention for book
Cover of 'Three Dimensional System Integration'

Table of Contents

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    Book Overview
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    Chapter 1 Introduction to Three-Dimensional Integration
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    Chapter 2 TSV-Based 3D Integration
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    Chapter 3 TSV Characterization and Modeling
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    Chapter 4 Homogeneous 3D Integration
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    Chapter 5 3D Physical Design
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    Chapter 6 Co-optimization of Power, Thermal, and Signal Interconnect for 3D ICs
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    Chapter 7 PathFinding and TechTuning
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    Chapter 8 3D Stacking of DRAM on Logic
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    Chapter 9 Microprocessor Design Using 3D Integration Technology
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    Chapter 10 3D Through-Silicon Via Technology Markets and Applications
Attention for Chapter 8: 3D Stacking of DRAM on Logic
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Citations

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Chapter title
3D Stacking of DRAM on Logic
Chapter number 8
Book title
Three Dimensional System Integration
Published by
Springer, Boston, MA, January 2011
DOI 10.1007/978-1-4419-0962-6_8
Book ISBNs
978-1-4419-0961-9, 978-1-4419-0962-6
Authors

Trevor Carlson, Marco Facchini

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Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 1 100%

Demographic breakdown

Readers by professional status Count As %
Professor 1 100%
Readers by discipline Count As %
Computer Science 1 100%

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