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| Chapter title |
3D Through-Silicon Via Technology Markets and Applications
|
|---|---|
| Chapter number | 10 |
| Book title |
Three Dimensional System Integration
|
| Published by |
Springer, Boston, MA, January 2011
|
| DOI | 10.1007/978-1-4419-0962-6_10 |
| Book ISBNs |
978-1-4419-0961-9, 978-1-4419-0962-6
|
| Authors |
E. Jan Vardaman |