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Metallization of Polymers 2

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Cover of 'Metallization of Polymers 2'

Table of Contents

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    Book Overview
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    Chapter 1 Surface Analysis Using Confocal Raman Micro-Spectroscopy
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    Chapter 2 Ellipsometric Characterization of the Optical Constants of Metals: Thin Film versus Nanoparticle
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    Chapter 3 Ultra Thin Film Analysis using Thermo VG Scientifics Thetaprobe Instrument
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    Chapter 4 Nanoindentation of Microsprings and Microcantilevers
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    Chapter 5 Physical and Interfacial Properties of Low Permittivity Polymers: Silk and Ultra-Low K
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    Chapter 6 Mechanical Properties of Cured SiLK Low-K Dielectric Films
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    Chapter 7 Plasma-Polymerized Fluoropolymer Thin Films for Microelectronic Applications
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    Chapter 8 Fundamental Aspects of Polymer Metallization
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    Chapter 9 The Study of Copper Clusters on Dow Cyclotene and Their Stability
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    Chapter 10 Metallization of Polymers 2
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    Chapter 11 Nucleation and Growth of Vapor-Deposited Metal Films on Self-Assembled Monolayers Studied by Multiple Characterization Probes
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    Chapter 12 Morphological Investigations of Low-k Polymer/Diffusion Barrier Interfaces for IC Metallization
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    Chapter 13 Chemistry in the Initial Formation of Nitride Barriers on Low-K Dielectrics
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    Chapter 14 Capabilities and Limitations of RBS to Characterize Hyper-Thin Silicon Compound Layers on Various Polymeric Substrates
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    Chapter 15 Surface Modification by Ion Assisted Reaction
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    Chapter 16 Plasma and VUV Pretreatments of Polymer Surfaces for Adhesion Enhancement of Electrolessly Deposited Ni or Cu Films
Attention for Chapter 13: Chemistry in the Initial Formation of Nitride Barriers on Low-K Dielectrics
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Chapter title
Chemistry in the Initial Formation of Nitride Barriers on Low-K Dielectrics
Chapter number 13
Book title
Metallization of Polymers 2
Published by
Springer, Boston, MA, January 2002
DOI 10.1007/978-1-4615-0563-1_13
Book ISBNs
978-1-4613-5134-4, 978-1-4615-0563-1
Authors

Peter Abramowitz, Junjun Liu, Michael Kiene, Paul S. Ho, Jay Im

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