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Mendeley readers
| Chapter title |
Early Estimation of TSV Area for Power Delivery in 3-D ICs
|
|---|---|
| Chapter number | 5 |
| Book title |
Designing TSVs for 3D Integrated Circuits
|
| Published by |
Springer, New York, NY, January 2013
|
| DOI | 10.1007/978-1-4614-5508-0_5 |
| Book ISBNs |
978-1-4614-5507-3, 978-1-4614-5508-0
|
| Authors |
Nauman Khan, Soha Hassoun |
Mendeley readers
The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 1 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Researcher | 1 | 100% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 1 | 100% |