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| Chapter title |
Conclusions and Future Directions
|
|---|---|
| Chapter number | 7 |
| Book title |
Designing TSVs for 3D Integrated Circuits
|
| Published by |
Springer, New York, NY, January 2013
|
| DOI | 10.1007/978-1-4614-5508-0_7 |
| Book ISBNs |
978-1-4614-5507-3, 978-1-4614-5508-0
|
| Authors |
Nauman Khan, Soha Hassoun |