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Designing TSVs for 3D Integrated Circuits

Overview of attention for book
Cover of 'Designing TSVs for 3D Integrated Circuits'

Table of Contents

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    Book Overview
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    Chapter 1 Introduction
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    Chapter 2 Background
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    Chapter 3 Analysis and Mitigation of TSV-Induced Substrate Noise
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    Chapter 4 TSVs for Power Delivery
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    Chapter 5 Early Estimation of TSV Area for Power Delivery in 3-D ICs
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    Chapter 6 Carbon Nanotubes for Advancing TSV Technology
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    Chapter 7 Conclusions and Future Directions
Attention for Chapter 7: Conclusions and Future Directions
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