↓ Skip to main content
What is this page? Embed badge

Advanced Thermal Management Materials

Overview of attention for book
Cover of 'Advanced Thermal Management Materials'

Table of Contents

  1. Altmetric Badge
    Book Overview
  2. Altmetric Badge
    Chapter 1 Introduction to Thermal Management in Microelectronics Packaging
  3. Altmetric Badge
    Chapter 2 Requirements of Thermal Management Materials
  4. Altmetric Badge
    Chapter 3 Overview of Traditional Thermal Management Materials
  5. Altmetric Badge
    Chapter 4 Development of Advanced Thermal Management Materials
  6. Altmetric Badge
    Chapter 5 Properties of WCu, MoCu, and Cu/MoCu/Cu High-performance Heat Sink Materials and Manufacturing Technologies
  7. Altmetric Badge
    Chapter 6 Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications
  8. Altmetric Badge
    Chapter 7 Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications
  9. Altmetric Badge
    Chapter 8 AlSiC Thermal Management Materials
  10. Altmetric Badge
    Chapter 9 Understanding Lasers, Laser Diodes, Laser Diode Packaging and Their Relationship to Tungsten Copper
  11. Altmetric Badge
    Chapter 10 Future Trend of Advanced Thermal Management Materials
Attention for Chapter 10: Future Trend of Advanced Thermal Management Materials
Altmetric Badge

Citations

dimensions_citation
39 Dimensions
Summary Dimensions citations
You are seeing a free-to-access but limited selection of the activity Altmetric has collected about this research output. Click here to find out more.
Chapter title
Future Trend of Advanced Thermal Management Materials
Chapter number 10
Book title
Advanced Thermal Management Materials
Published by
Springer, New York, NY, January 2013
DOI 10.1007/978-1-4614-1963-1_10
Book ISBNs
978-1-4614-1962-4, 978-1-4614-1963-1
Authors

Guosheng Jiang, Liyong Diao, Ken Kuang

View on publisher site

This page is provided by Altmetric.