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Advanced Thermal Management Materials

Overview of attention for book
Cover of 'Advanced Thermal Management Materials'

Table of Contents

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    Book Overview
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    Chapter 1 Introduction to Thermal Management in Microelectronics Packaging
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    Chapter 2 Requirements of Thermal Management Materials
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    Chapter 3 Overview of Traditional Thermal Management Materials
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    Chapter 4 Development of Advanced Thermal Management Materials
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    Chapter 5 Properties of WCu, MoCu, and Cu/MoCu/Cu High-performance Heat Sink Materials and Manufacturing Technologies
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    Chapter 6 Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications
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    Chapter 7 Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications
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    Chapter 8 AlSiC Thermal Management Materials
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    Chapter 9 Understanding Lasers, Laser Diodes, Laser Diode Packaging and Their Relationship to Tungsten Copper
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    Chapter 10 Future Trend of Advanced Thermal Management Materials
Attention for Chapter 4: Development of Advanced Thermal Management Materials
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Chapter title
Development of Advanced Thermal Management Materials
Chapter number 4
Book title
Advanced Thermal Management Materials
Published by
Springer, New York, NY, January 2013
DOI 10.1007/978-1-4614-1963-1_4
Book ISBNs
978-1-4614-1962-4, 978-1-4614-1963-1
Authors

Guosheng Jiang, Liyong Diao, Ken Kuang

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