Chapter 1 Thermodynamics and phase diagrams of lead-free solder materials

Chapter 2 Phase diagrams of Pb-free solders and their related materials systems

Chapter 3 The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

Chapter 4 Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications

Chapter 5 Rare-earth additions to lead-free electronic solders

Chapter 6 Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders

Chapter 7 Sn-Zn low temperature solder

Chapter 8 Composite lead-free electronic solders

Chapter 9 Processing and material issues related to lead-free soldering

Chapter 10 Interfacial reaction issues for lead-free electronic solders

Chapter 11 Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys

Chapter 12 Deformation behavior of tin and some tin alloys

Chapter 13 Mechanical fatigue of Sn-rich Pb-free solder alloys

Chapter 14 Life expectancies of Pb-free SAC solder interconnects in electronic hardware

Chapter 15 Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments

Chapter 16 Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Chapter 17 Electromigration issues in lead-free solder joints

Chapter 18 Stress analysis of spontaneous Sn whisker growth

Chapter 19 Sn-whiskers: truths and myths

Chapter 20 Tin pest issues in lead-free electronic solders

Chapter 21 Issues related to the implementation of Pb-free electronic solders in consumer electronics

Chapter 22 Impact of the ROHS directive on high-performance electronic systems

Chapter 23 Impact of the ROHS Directive on high-performance electronic systems