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Three Dimensional System Integration

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Cover of 'Three Dimensional System Integration'

Table of Contents

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    Book Overview
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    Chapter 1 Introduction to Three-Dimensional Integration
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    Chapter 2 TSV-Based 3D Integration
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    Chapter 3 TSV Characterization and Modeling
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    Chapter 4 Homogeneous 3D Integration
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    Chapter 5 3D Physical Design
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    Chapter 6 Co-optimization of Power, Thermal, and Signal Interconnect for 3D ICs
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    Chapter 7 PathFinding and TechTuning
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    Chapter 8 3D Stacking of DRAM on Logic
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    Chapter 9 Microprocessor Design Using 3D Integration Technology
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    Chapter 10 3D Through-Silicon Via Technology Markets and Applications
Attention for Chapter 6: Co-optimization of Power, Thermal, and Signal Interconnect for 3D ICs
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