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Testing of Interposer-Based 2.5D Integrated Circuits

Overview of attention for book
Cover of 'Testing of Interposer-Based 2.5D Integrated Circuits'

Table of Contents

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    Book Overview
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    Chapter 1 Introduction
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    Chapter 2 Pre-bond Testing of the Silicon Interposer
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    Chapter 3 Post-bond Scan-Based Testing of Interposer Interconnects
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    Chapter 4 Test Architecture and Test-Path Scheduling
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    Chapter 5 Built-In Self-Test
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    Chapter 6 ExTest Scheduling and Optimization
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    Chapter 7 A Programmable Method for Low-Power Scan Shift in SoC Dies
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    Chapter 8 Conclusions
Attention for Chapter 6: ExTest Scheduling and Optimization
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