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Trends in 3D Integrated Circuit (3D-IC) Testing Technology
Three-Dimensional Integration of Semiconductors
Springer, Cham, January 2015
Hiroshi Takahashi, Senling Wang, Shuichi Kameyama, Yoshinobu Higami, Hiroyuki Yotsuyanagi, Masaki Hashizume, Shyue-Kung Lu, Zvi Roth
The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.
|Readers by professional status||Count||As %|
|Professor > Associate Professor||1||100%|
|Readers by discipline||Count||As %|